T |
Printing |
Max PCB size |
900*600mm² |
Max PCB weight |
8kg |
Solder paste printing tolerance |
±25μm(6σ) |
System repeat calibration tolerance |
±10μm(6σ) |
Scraper pressure detection |
pressure closed-loop control system |
SPI |
Detect Min BGA PAD to PAD distance |
100μm |
x-axis and Y-axis tolerance |
0.5μm |
False Rate |
≤0.1% |
Mount |
Component size |
0.3*0.15 mm²--200*125 mm² |
Component max height |
25.4mm |
Populate Max component weight |
100g |
BGA/CSP Min PAD spacing, and Min PAD diameter |
0.30mm,0.15mm |
Populate tolerance |
±22μm(3σ),±0.05°(3σ) |
PCB board size |
50*50 mm²-850*560 mm² |
PCB thickness |
0.3mm--6mm |
Max PCB weight |
6kg |
Populate Max components type |
500 |
AOI |
Detect Min components |
01005 |
Detect false type |
Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball |
Foot warping detection |
3D Detection function |
Reflow |
Temperature Accuracy |
±1ºC |
Welding protection |
nitrogen protection;(remaining oxygen<3000ppm) |
Nitrogen Control |
Nitrogen closed-loop control system,±200ppm |
3D X-Ray |
Magnification |
Geometric Magnification;:2000 times;System Magnification:12000times |
Resolution |
1μm /nm |
Rotation Angle &Slanting Perspective |
Any ±45°+360°rotation |
DIP |
Preelaboration |
Automatic forming technology |
Component Automatic forming |
DIP |
DIP technology |
Automatic Insertion machine |
Wave soldering |
Wave soldering type |
Ordinary wave soldering |
Inclination angle of transport guide rail |
4--7° |
Temperature accuracy |
±3ºC |
Soldering protection |
nitrogen protection |
Non-welding pressure contact technology |
Max PCB board size |
800*600mm² |
Press down height accuracy |
±0.02mm |
Pressure Range |
0-50KN |
Pressure Accuracy |
Standard value:±2% |
Hold time |
0-9.999S |
Conformal coating technology |
Max PCB board size |
500*475*6mm |
Max PCB board weight |
5kg |
Min Nozzle size |
2mm |
Other characteristic |
Conformal coating pressure Programmable control |
ICT test |
test level |
Device level test,Test hardware connection status. |
Test point |
>4096 |
Test content |
Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test. |
Assembly and test |
Production type |
TouchPad |
Mass production |
TWS |
Mass production |
Baby Camera |
Mass production |
Gaming controller |
Mass production |
Life Watch |
Mass production |
FT test |
test level |
PCB board system level test.Test System function status. |
Temperature cycling test |
Temperature range |
-60ºC--125ºC |
Rise/lower temperature rate |
>10ºC/min |
Temperature tolerance |
≤2ºC |
Other Reliability test |
burn-in test,Drop test, vibration test , Abrasion test ,Key life test. |