OEM Electronic PCB&PCBA Manufacturer, Assembly PCB PCBA

• Material: Fr4, Cem1, Cem3, High Frequency Board,
• Production Capacity: 10000000/Month

Product Description

PCB Production Capacity:

PCB Item	Standard	Advanced
Layer Counts:	1L--10L, HDI	10L-18L,HDI
Base Material:	CAM1,FR4,F4BK,Arlon
Material Suppliers:	GUOJI(GDM), KINGBOARD(KB), SHENGYI,Arlon
Material Thickness(mm):	0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
Max board size(mm):	1200x400mm	1200x500mm
Board Outline Tolerance:	±0.15mm	±0.01mm
Board Thickness:	0.4mm--3.2mm	0.3mm----3.2mm
Thickness Tolerance:	±8%	±5%
Minimum line/space:	0.1mm
Mini Hole Size(mechanical):	0.2mm
Innerlayer Copper Weight:	0.1mm
Innerlayer Copper Weight:	17um--105um
Outlayer Copper Weight:	17um--105um
Mini Solder Mask Bridge:	0.05mm
Impedance Control Tolerance:	±10%
Contours:	Scored, Routed, Punched
Surface Finishing:	HAL,lead-free HAL,ENIG,Plated Gold,Immersion Silver,OSP
1--2L Lead Time:	3-7 days
4--18L Lead Time:	7-10 days
Acceptable File Format:	Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
Quality Standards:	IPC-A-600H Class2
Certificate:	ISO9001:2008,PCB Assembly Capability

PCB Assembly Capability:

Stencil Size:	736x736mm
Minimum IC Pitch:	0.2mm
Maximum PCB size:	1200x 500mm
Minimum PCB thickness:	0.25mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Volume:	One piece to low volume production quantities Low cost first article builds Schedule deliveries
Assembly type:	Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly
Components type:	Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Parts procurements:	Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder type:	Leaded Lead-free/ROHS compliant
Other capabilities:	Repair/rework services Mechanical assembly Box build Mold and plastic injection.